Technical Specifications Product Type CPU Air Cooler Model XPG MAESTRO PLUS 62DA Cooling Capacity Up to 250W TDP Heatsink Design Dual-tower, high-density fin stack (large surface area) Heatpipes 6 direct-touch heatpipes Fan Bearing FDB (Fluid Dynamic Bearing) Acoustics Under 22 dB(A) average (with smart fan curve) Lighting ARGB Status Monitoring Digital status panel with real-time CPU temperature and CPU/RAM usage monitoring Software Support XPG PRIME support for monitoring and data logs (graph view) CPU Socket Compatibility Intel LGA 1851, AMD Socket AM5 Product Description Performance The XPG MAESTRO PLUS 62DA is built for modern high-core-count CPUs, delivering up to 250W TDP cooling headroom to sustain boost clocks under heavy loads. Its dual-tower heatsink with high-density fins increases heat dissipation surface area, helping maintain stable temperatures during long gaming sessions and CPU-intensive competitive titles. For creators, the 6 direct-touch heatpipes improve thermal transfer efficiency to reduce throttling in rendering, compilation, and multi-threaded workloads. The integrated digital status panel provides at-a-glance visibility into CPU temperature and CPU/RAM utilization, making it easier to validate performance tuning and system stability. With support for XPG PRIME, it can also log monitoring data for deeper performance analysis over time. Display Support As a CPU air cooler, the MAESTRO PLUS 62DA does not provide display connectivity. Instead, it enhances platform stability by keeping CPU thermals under control, which is essential for consistent frame times in gaming, sustained clocks in creative applications, and reliable performance in professional workloads. Power & Compatibility The MAESTRO PLUS 62DA is compatible with Intel LGA 1851 and AMD Socket AM5, making it a strong fit for current-generation desktop builds. Its ARGB lighting is designed to integrate with standard motherboard ARGB ecosystems, simplifying synchronization with the rest of your system lighting. The cooler’s monitoring-focused design is intended to work alongside XPG PRIME software for system telemetry and logging. For best results, ensure your PC case supports a dual-tower air cooler height and provides adequate airflow to feed the fin stacks with cool intake air. Cooling & Build This cooler uses a dual-tower architecture paired with 6 direct-touch heatpipes to move heat rapidly from the CPU into the fin arrays for efficient dissipation. The high-density fin design increases thermal exchange area, improving cooling performance in sustained loads where heat saturation is common. An FDB fan design is used to balance airflow and longevity while keeping noise controlled, with an average acoustic target under 22 dB(A) when governed by a smart fan curve. ARGB lighting adds a premium build aesthetic, while the digital status panel reinforces a performance-first approach by keeping key system metrics visible during gaming and production work. What’s in the Box CPU air cooler (heatsink assembly) Cooling fan(s) Mounting hardware for Intel LGA 1851 Mounting hardware for AMD Socket AM5 Thermal paste User manual and installation guide
